Budatec GmbH produces equipment for the semiconductor and photovoltaic industries and is located in Berlin. Our main business areas are thermal systems and electronic manufacturing products.
Our focus is on vacuum soldering systems, ranging from small Batch installations to fully automated production systems. We have more than 20 years experience in this area. Our vacuum soldering systems are developed and built at our Berlin site and are distributed world wide. Budatec GmbH is one of the technological market leaders in this segment, especially around the use of hydrogen and plasma gases.
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- Vacuum soldering process up to 450°C for void-free application and flux-free application!
- Vacuum is used for gas exchange during the process! (inert gas, reducing gases, oxidation gases and cleaning gases)
- Vacuum is used to eliminate gas bubbles (voids) during the liquid phase of the solder alloy!
- Defined low-pressure rates or defined gases can be used during „sealing “of electronic circuit housings!
VS160 S
Dimensions:
Technical
Data:
| Plate size: | 160mm x 160mm |
| max. substrate height: | 50mm |
| max. solder temperature: | 450°C |
| Heat up / cool down: | max. 3 K/s |
| max. load: | 2.5 kg |
| Posible process gases: | N2; N2H2 95/5% |
| Power supply: | 400V / 16A |
| Cooling water: | 10 slm |
| Weight: | ~ 50 kg |
Options:
| Absolute pressure management |
| Rotary vane pump with accessory |
| Datalogging software |
| Frame for gas inlet and pump adaptation |
| Formic acid gas line with bubbler |
VS160 UG
Dimensions:
Technical
Data:
| Plate size: | 160mm x 160mm |
| max. substrate height: | 50mm |
| max. solder temperature: | 450°C |
| Heat up / cool down: | max. 3 K/s |
| max. load: | 2.5 kg |
| Posible process gases: | N2; N2H2 95/5% |
| Power supply: | 400V / 16A |
| Cooling water: | 10 slm |
| Weight: | ~ 80 kg |
Options:
| Absolute pressure management |
| Rotary vane pump with accessory |
| Datalogging software |
| Frame for gas inlet and pump adaptation |
| Formic acid gas line with bubbler |
VS320
Dimensions:
Technical
Data:
| Plate size: | 320mm x 320mm |
| max. substrate height: | 100mm |
| max. solder temperature: | 450°C |
| Heat up / cool down: | max. 2.5 K/s |
| max. load: | 15 kg |
| Posible process gases: | N2 ; N2H2 95/5% ; H2 bis100% |
| Power supply: | 400V / 32A |
| Cooling water: | 10 slm |
| Weight: | ~ 300 kg |
Options:
| Formic acid gas line with bubbler |
| Maximum of 5 gas lines |
| Datalogging software |
| Integrated plasma equipment |
| High vacuum pump |
VSXL
VSXL size of the heating plate 1000mm x 320mm
VS320i
