PACTECH Advanced Packaging Equipment

SB2 - Jet

SB²-Jet Laser Solder Jetting System The SB²-Jet is the most advanced system for automated high-speed sequential solder-ball attach and laser reflow. The system is capable to singulate, to position and to reflow solder balls with a diameter between 40 µm and 760 µm.


SB²-WB Laser Solder Jetting System The SB²-WB is a combination of PacTech’s unique solder ball jetting technology with a wire feeding mechanism to perform wiring process. This innovative solution has very low stress as it is bonded with very short laser pulse and requires no mechanical contact. The system is highly flexible, with various loop formation capabilities or even no wire loop formation to enable smaller package size, at the same time allowing combination of different solder alloy and wire, wire bundles or ribbon. Higher reliability as compared to conventional wire bonding with consistent wire thickness and better match of CTE variation between materials. Additionally, the solder wire bond can be reworked selectively at ease. SB²-WB is a flexible wire-bonding alternative for multifunctional system platforms and heterogeneous integration.


LAPLACE-FC Laser Flip Chip Bonder The LAPLACE-system provides an integrated solution for flip chip assembly. The laser assisted assembly is applied for soldering, ACF and NCP interconnections. The optional dispensing unit in the flip chip assembly platform allows a maximal flexibility for flux, solder paste and/or ACF, NCP dispense. Highlights Flip chip placement, reflow & curing in one step Fluxfree reflow with laser No additional reflow or curing Suitable for Flip Chip Soldering and adhesive Flip Chip: ACF, NCP, ICA Substrate materials: PI, PVC, PE, Polyester Paper based low cost substrates and others

Wafer Level UBM Plating


PacLine 300 A50 The – PacLine 300 A50 – is a fully automated equipment for electroless deposition of Ni/Au, NiPd or NiPdAu bumps on semiconductor wafers with Al or Cu pad metallization. The system is able to process carriers with 50 wafers up to 8” and 20 wafers 12”. The PacLine contains of a complete software solution for recipe management, process control and data logging. Complex failure and emergency routines are providing a secure system operation for handling of up to 4 process carrier in parallel. The usage of SECS GEM communication protocol enables direct interfacing with the facility host and flexible final adjustment on customer requirements. Pac Tech is offering standard configured and industry proven bumping line’s as well as customized wet benches. The modular bumping line consists of an input/output station, a customized number of process modules, Quick Dump Rinse tanks, drying station and automatic Ni stripping. Pac Tech offers a turnkey solution by delivering the equipment and the process chemicals in combination with a technology transfer.