Tresky Die Bonders

Tresky Die Bonders are among the most accurate Die bonders in the Market with a placement accuracy of 3-5um

Automatic R&D Die-Bonder

The T-6000L Die Bonder is a fully-automated all-purpose system for R&D, pilot and medium size production.
Equipped with linear motors and 0.1µm resolution glass scales, enable a precision of 8µm.
A force range of 20g to 800g (optional 10g to 5kg), combined with the large working area of 400 x 315mm and wafer handling up to 8”, open a wide range of applications. With numerous available options,
the T-6000L can be customized to best suit your needs.

T-8000 Flexible Automatic Die Bonder

The T-8000 Die Bonder is a fully-automated all-purpose system for R&D, pilot and medium size
production. Fully built on granite, equipped with linear motors and 0.1µm resolution glass scales, enable
a precision of 5µm. A force range of 10g to 25kg, combined with the large working area of 500 x 450mm
and wafer handling up to 12”, open a wide range of applications. With numerous available options, the T-8000 can be customized to best suit your needs.