CA20

Designed to cover the entire semiconductor manufacturing chain, from wafer processing to packaged chips
Available with fully automated operation for seamless integration into your fab
AI-based data analysis and advanced software ensures fast, accurate defect classification to resolve systematic issues and maximize yield
Non-destructive technology for three-dimensional insights into solder bumps or TSVs within minutes
Repeatable results through reliable and accurate technology, designed to support a stable inspection routine
Cleanroom ready, with conditions within the cabinet comparable to ISO Class 3

A 2D Slice taken from a 3D X-ray (CL) scan of a commercially available GPU.

CA20 inspection applications in R&D and production

Chip-on-Substrate including Fan Out packaging solder connections (C4 bumps and copper pillars)
2.5 and 3D IC package solder connections including microbumps
TSV inspection
Substrate strip solder bumps
Sensors
MEMS and MOEMS

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