COMET YXLON CHEETAH EVO–MICROFOCUS / NANOFOCUS
X-ray Inspection System for PCBA and Semiconductors

• Fast and intuitive scan set-up
• High detail resolution at submicron level for 2D, 2.5 D and 3D imaging
• Best-in-class laminography
• Automated inspection programs and software-assisted image review
• Dose monitoring for sensitive parts
• Optional high load capacity (≤20 kg)
• Seamlessly integrated 3D visualization with optional AI-powered image analysis

Key Benefits

• Ultimate quality resolution for failure analysis applications
• High-performance CT inspection for all demanding applications
• Highest industry CT reconstructions with VGStudio and Siemens Software

Applications

• Wafer inspection
• 3D integrated circuit joints
• Microbumps
• Sensors
• MEMS and MOEMS
• TSV’s

Visual inspection of 3D volumes with Dragonfly 3D View