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LAPLACE-FC

The LAPLACE-system provides an integrated solution for flip chip assembly.

Highlights

  • Flip chip placement, reflow & curing in one step
  • Fluxfree reflow with laser
  • No additional reflow or curing
  • Suitable for Flip Chip Soldering and adhesive¬†Flip Chip: ACF, NCP, ICA
  • Substrate materials: PI, PVC, PE, Polyester Paper based low cost substrates and others

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