Provides an integrated solution for flip chip assembly

• Flip chip placement, reflow & curing in one step
• In-situ reflow resulting in no thermal stress outside of bonding areas
• Flux free reflow with laser
• No additional reflow or curing
• Suitable for Flip Chip Soldering and adhesive Flip Chip: ACF, NCP, ICA
• Substrate materials:
  • PI, PVC, PE, Polyester
  • Paper based low cost substrates and others