ELECTROLESS PLATING MACHINE
PACLINE is a fully automated wet chemical plating system for applying Nickel, Palladium and Gold (Ni/Pd/Au) onto Aluminium or Copper bond pads on semiconductor wafers.
The plated layers improve adhesion, diffusion protection and solder/wire bonding, supporting reliable semiconductor packaging applications such as Flip Chip and WLCSP.
With automated wafer handling and precise chemical control, PACLINE delivers consistent and reliable plating results for low to high-volume production.