SB²-Jet Laser Solder Jetting System
The SB²-Jet is the most advanced system for automated high-speed sequential solder-ball attach and laser reflow. The system is capable to singulate, to position and to reflow solder balls with a diameter between 40 µm and 760 µm.

• Ball Inspection System (2-D)
• Automatic Z-Height Measurement
• ESD Kit
• Heated chuck/work stage
• Specific heated work holder for BGA-like devices
• Solder Ball Rework Station
• Automatic Wafer Handling System 6”-12”
• Automatic Reel to Reel System
• Automatic Inline Conveyor System
• Expand working area > 320x320mm