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SB² – SM


Being a lower cost version of the SB² ® – Jet without compromising its placement accuracy, the SB² ® – SM is a sequential solder ball attach and laser reflow system that can operate either in a fully automatic or in a semiautomatic mode. With larger work area than the SB² ® – M , yet relatively compact foot print than the SB² ® – Jet, it is ideal for research & development, prototyping and small volume manufacturing.

  • Jet mode/Standard mode
  • Available solder ball diameter: 60 – 760μm
  • Suitable for chip/wafer/substrate soldering
  • Optional ball rework (de-balling & re-balling) capability

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