- Jet mode/Standard mode
- Available solder ball diameter: 60 – 760μm
- Suitable for chip/wafer/substrate soldering
- Optional ball rework (de-balling & re-balling) capability
SB² – SM
Being a lower cost version of the SB² ® – Jet without compromising its placement accuracy, the SB² ® – SM is a sequential solder ball attach and laser reflow system that can operate either in a fully automatic or in a semiautomatic mode. With larger work area than the SB² ® – M , yet relatively compact foot print than the SB² ® – Jet, it is ideal for research & development, prototyping and small volume manufacturing.
