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SIGMA W8 BOND TESTER

SIGMA W8 BOND TESTER


Bond tester for wafers 4 – 8 inch

  • Bondtester for wafers or at wafer level 4” – 8” (up to 200 mm)
  • Fully automatic wafer bond tester
  • X/Y stages X: 370 mm, Y: 370 mm
  • Force range from 1 gf – 10 kgf
  • Bump pitch down to 50 µm
  • Full automation

Wafer Loader
Integrate the Sigma W8 with an independent wafer (un)loader for hands-free bond testing. The wafer handler automatically loads, aligns and transfers the wafers from the cassette onto the bond tester. The cassette mapper detects empty slots and ensures safe wafer handling.

 

Upgrade to Sigma W12
The Sigma W8 is upgradeable to the market-leading Sigma W12 bond tester, which can test wafers up to 12 inches (300 mm) fully automatically. The Sigma W12 comes with a 600 mm X stage to test bumps down to 20 µm. The upgrade possibility makes the Sigma W8 a future-proof investment.

 

Lift pins
The system gently secures flat and warped wafers with the soft, flexible tips on the PID controlled  wafer lift pins.

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