T-3002-M
Manual Die Bonder
The T-3002-M is a manual, precise, high quality die bonder & component placer with superior ergonomic design and a fix die ejector needle. As with all of Tresky’s products, the T-3002-M incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height.
The T-3002-M is equiped with Tresky’s die ejector system for pick-up from wafer.
