Manual Die Bonder with semi-automatic process capability
The T-5300 is the flagship of our die bonder line, expanding the versatile T-5100 series with a motorized, programmable Z-axis featuring True Vertical Technology™. This system excels in repetitive processes for small-series production, where maximum reproducibility and minimal operator influence are required — such as flip-chip or eutectic bonding. For wafer applications, the T-5300-W is also available with an electric die ejector system. An optional beamsplitter enables placement accuracy in the sub-micron range.