Manual High-Force Die Bonder with Semi-Automatic Process Capability
The T-5500 from Tresky expands the product line of the T-5100 and T-5300 with a high-force machine. The sophisticated design of the integrated high-force module, enabling forces up to 100 kg, ensures absolute parallelism between chip and substrate at any height and force during the bonding process – thanks to Tresky’s True Vertical Technology.