- Detectable Defects
Particles, missing patterns, scratches, residues, contamination, pattern adhesion, etc. - High-precision 3D Optical Imaging System
Specifically developed for advanced packaging, ensures accurate and stable inspection results. - AI Algorithm
Integrates with latest generation of AI intelligent detection algorithms, requiring only a small number of images of good products for model training. This facilitates AI deployment and is convenient and efficient. - Optical Hardware
High-resolution industrial area scan camera, microscope optical system, 4-wheel nosepiece, equipped with 2x, 5x, 10x, and 20x microscope objectives, minimum pixel resolution 0.225 μm - Data Indicators
Supports 8/12-inch bare wafers, ring wafers, microporous ceramic X/Y/R, wafer stages, dual Foup automatic loading, automatic optical focus, automatic position correction, and automatic objective lens switching. - Advantages
A 100% integrated 2D and 3D measurement and inspection system capable of measuring bumps as small as 2µm in height. Patented reflection suppression technology allows inspection of highly reflective surfaces.
Wafer AOI – Spectra
Inspects solder joints and component quality after wave soldering to ensure defect-free assembly and long-term reliability.
