XYZTEC Material Testers

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CONDOR SIGMA
BONDTESTER

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  • Full automation
  • 0.075% accuracy
  • Best ergonomics
  • Highest throughput
  • Lowest cost of ownership
  • On board 10gf to 200kgf pull
  • Shear sensors available at the touch of a button
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  • Precision shear testing and Cold Bump Pull (CBP)
  • Big bump removal to prepare for wafer probing
  • Bump sizes down to 20µm
  • Available with or without wafer handler (EFEM)
  • XY mapping coordinates key in function
  • Grading run functionality
  • Up to 4 USB Tweezers in 1 RMU
  • Easy positioning, alignment
  • High resolution cameras with high and low magnifications
  • Fastest throughput of wafer bump testing in the world
  • 500mm X-stage and 370mm Y-stage, throat depth 400mm
  • Integrated report editor and flexible data export
  • Reach 100% of the 300mm wafer without repositioning the wafer on the chuck
  • Blower and vacuum tool cleaning unit
  • Wafer chuck with safety interlocks and 360 degree rotation
  • Wafer carrier mechanically locked when vacuum is turned on
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CONDOR SIGMA W12 BONDTESTER

  • Complies with JEDEC JESD22-B117A, JEDEC JESD22-B115, JEITA EIAJ ET-7407 and IPC-9708 standards
  • Also suitable for 200mm (8 inch) and other wafer sizes
  • 24 bit ADC resolution, 10kHz sampling frequency
  • Compatible with Revolving Measurement Unit (RMU) and single heads
  • SECS/GEM protocol
  • Wafer pusher to test warped wafers
  • Unparallelled 0.075% accuracy
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CONDOR SIGMA 
W12 BONDTESTER

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  • Precision shear testing and Cold Bump Pull (CBP)
  • Big bump removal to prepare for wafer probing
  • Bump sizes down to 20µm
  • Available with or without wafer handler (EFEM)
  • XY mapping coordinates key in function
  • Grading run functionality
  • Up to 4 USB Tweezers in 1 RMU
  • Easy positioning, alignment
  • High resolution cameras with high and low magnifications
  • Fastest throughput of wafer bump testing in the world
  • 500mm X-stage and 370mm Y-stage, throat depth 400mm
  • Integrated report editor and flexible data export
  • Reach 100% of the 300mm wafer without repositioning the wafer on the chuck
  • Blower and vacuum tool cleaning unit
  • Wafer chuck with safety interlocks and 360 degree rotation
  • Wafer carrier mechanically locked when vacuum is turned on
  • Complies with JEDEC JESD22-B117A, JEDEC JESD22-B115, JEITA EIAJ ET-7407 and IPC-9708 standards
  • Also suitable for 200mm (8 inch) and other wafer sizes
  • 24 bit ADC resolution, 10kHz sampling frequency
  • Compatible with Revolving Measurement Unit (RMU) and single heads
  • SECS/GEM protocol
  • Wafer pusher to test warped wafers
  • Unparallelled 0.075% accuracy
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Revolving Measurement Unit (RMU)

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  • Unique multiple load cell cartridge (RMU)
  • User can choose up to 6 sensors in any combination: multiple test types, tools and spare sensors, including up to 6 USB Tweezers and rotation
  • Up to 200kgf shear, push and pull
  • Intelligent parking options
  • Deep Access capability
  • Integrated lighting options
  • Configurable with multiple tweezers solutions
  • Single heads and RMU share the same test point
  • If one sensor is down, the others still work – Lowest Cost of Ownership
  • Quick take off
  • Unparalleled 0.075% accuracy
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Condor Sigma now comes with Automatic loaders.

Semi or Fully automatic, fully integrated Magazine loaders available now to supplement our unrivalled automation solutions for multiple applications.

Email us to discuss your applications!

Download the Brochure Here

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Condor Sigma now comes with Automatic loaders.

Semi or Fully automatic, fully integrated Magazine loaders available now to supplement our unrivalled automation solutions for multiple applications.

Email us to discuss your applications!

Download the Brochure Here

New Product

CONDOR-SIGMA HF

CONDOR-SIGMA HF

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Download brochure here